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INTEGRATED CIRCUITS
DATA SHEET
74AHC164; 74AHCT164 8-bit serial-in/parallel-out shift register
Product specification File under Integrated Circuits, IC06 2000 Aug 15
Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
FEATURES * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V CDM EIA/JESD22-C101 exceeds 1000 V * Balanced propagation delays * All inputs have Schmitt-trigger actions * Inputs accept voltages higher than VCC * For AHC only: operates with CMOS input levels * For AHCT only: operates with TTL input levels * Specified from -40 to +85 C and from -40 to +125 C. DESCRIPTION
74AHC164; 74AHCT164
The 74AHC/AHCT164 shift registers are high-speed silicon-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specified in compliance with JEDEC standard No. 7A. The 74AHC/AHCT164 input signals are 8-bit serial through one of two inputs (Dsa or Dsb); either input can be used as an active HIGH enable for data entry through the other input. Both inputs must be connected together or an unused input must be tied HIGH. Data shifts one place to the right on each LOW-to-HIGH transition of the clock (CP) input and enters into Q0, which is a logical AND of the two data inputs (Dsa, Dsb) that existed one set-up time prior to the rising clock edge. A LOW level on the master reset (MR) input overrides all other inputs and clears the register asynchronously, forcing all outputs LOW.
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 3.0 ns. TYPICAL SYMBOL tPHL/tPLH PARAMETER propagation delay CP to Qn MR to Qn CI fmax CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; (CL x VCC2 x fo) = sum of outputs; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. input capacitance maximum clock frequency power dissipation capacitance VI = VCC or GND CL = 15 pF; VCC = 5 V CL = 50 pF; f = 1 MHz; notes 1 and 2 CONDITIONS AHC CL = 15 pF; VCC = 5 V 4.5 4.0 3 175 48 3.4 3.5 3 175 51 ns ns pF MHz pF AHCT UNIT
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
FUNCTION TABLE See note 1.
74AHC164; 74AHCT164
INPUTS OPERATING MODES MR reset (clear) shift L H H H H Note 1. H = HIGH voltage level; h = HIGH voltage level one set-up time prior to the LOW-to-HIGH clock transition; L = LOW voltage level; l = LOW voltage level one set-up time prior to the LOW-to-HIGH clock transition; = LOW-to-HIGH transition; X = don't care; CP X Dsa X l l h h Dsb X l h l h
OUTPUTS Q0 L L L L H Q1-Q7 L-L q0-q6 q0-q6 q0-q6 q0-q6
q = lower case letter indicates the state of the referenced input one set-up time prior to the LOW-to-HIGH transition. ORDERING INFORMATION PACKAGES TYPE NUMBER 74AHC164D 74AHC164PW 74AHCT164D 74AHCT164PW TEMPERATURE RANGE -40 to +125 C PINS 14 14 14 14 PACKAGE SO TSSOP SO TSSOP MATERIAL plastic plastic plastic plastic CODE SOT108-1 SOT402-1 SOT108-1 SOT402-1
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
PINNING PIN 1, 2 3, 4, 5, 6, 10, 11, 12, 13 7 8 9 14 Dsa, Dsb Q0 to Q7 GND CP MR VCC SYMBOL data input outputs
74AHC164; 74AHCT164
DESCRIPTION
ground (0 V) clock input (LOW-to-HIGH, edge-triggered) master reset input (active LOW) DC supply voltage
handbook, halfpage
handbook, halfpage
Dsa Dsb Q0 Q1 Q2 Q3 GND
1 2 3 4 5 6 7
MNA596
14 VCC 13 Q7 12 Q6
1 Dsa 2 Dsb
Q0 Q1 Q2 Q3
3 4 5 6 10 11 12 13
MNA597
164
11 Q5 8 10 Q4 9 8 MR CP 9 CP
Q4 Q5
MR
Q6 Q7
Fig.1 Pin configuration.
Fig.2 Logic symbol.
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
74AHC164; 74AHCT164
handbook, halfpage
8 9
SRG8 C1/ R
handbook, halfpage
1 2
&
1D
3 4 5 6 10 11
1 2 8 9
Dsa Dsb CP MR
8-BIT SERIAL-IN/PARALLEL-OUT SHIFT REGISTER
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
MNA598
3
4
5
6
10
11
12
13
12 13
MNA599
Fig.3 IEC logic symbol.
Fig.4 Functional diagram.
Dsa D Dsb Q D Q D Q D Q D Q D Q D Q D Q CP FF1 RD CP FF2 RD CP FF3 RD CP FF4 RD CP FF5 RD CP FF6 RD CP FF7 RD CP FF8 RD
CP MR
Q0
Q1
Q2
Q3
Q4
Q5
Q6
MNA600
Q7
Fig.5 Logic diagram.
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
RECOMMENDED OPERATING CONDITIONS
74AHC164; 74AHCT164
74AHC SYMBOL VCC VI VO Tamb PARAMETER DC supply voltage input voltage output voltage operating ambient temperature see DC and AC characteristics per device VCC = 3.3 0.3 V VCC = 5 0.5 V CONDITIONS MIN. 2.0 0 0 -40 -40 - - TYP. MAX. MIN. 5.0 - - +25 +25 - - 5.5 5.5 VCC +85 4.5 0 0 -40
74AHCT UNIT TYP. MAX. 5.0 - - +25 +25 - - 5.5 5.5 VCC +85 V V V C
+125 -40 100 20 - -
+125 C - 20 ns/V ns/V
tr, tf
input rise and fall ratios (t/V)
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC VI IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO packages: above 70 C the value of PD derates linearly by 8 mW/K. For TSSOP packages: above 60 C the value of PD derates linearly by 5.5 mW/K. PARAMETER DC supply voltage input voltage DC input diode current DC output clamping diode current DC output sink current DC VCC or GND current storage temperature power dissipation per package for temperature range: -40 to +125 C; note 2 VI < -0.5 V; note 1 -0.5 > VO > VCC + 0.5 V; note 1 -0.5 < VO < VCC + 0.5 V CONDITIONS MIN. MAX. UNIT -0.5 -0.5 - - - - -65 - +7.0 +7.0 -20 20 25 75 500 V V mA mA mA mA mW
+150 C
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
DC CHARACTERISTICS
74AHC164; 74AHCT164
74AHC family With regard to recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH HIGH-level input voltage VCC (V) 2.0 3.0 5.5 VIL LOW-level input voltage 2.0 3.0 5.5 VOH HIGH-level output voltage VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 4.0 mA VI = VIH or VIL; IO = 8.0 mA II IOZ ICC CI input leakage current 3-state output OFF-state current quiescent supply current input capacitance VI = VCC or GND 2.0 3.0 4.5 3.0 4.5 2.0 3.0 4.5 3.0 4.5 5.5 MIN. 1.5 2.1 - - - 1.9 2.9 4.4 - - - - - 2.0 3.0 4.5 25 TYP. - - - 0.5 0.9 1.65 - - - - - 0.1 0.1 0.1 0.36 0.36 0.1 Tamb (C) -40 to +85 - - 0.5 0.9 1.65 - - - -40 to +125 UNIT - - 0.5 0.9 1.65 - - -
MAX. MIN. MAX. MIN. MAX. 1.5 2.1 - - - 1.9 2.9 4.4 1.5 2.1 - - - 1.9 2.9 4.4 V V V V V V V V V V V V V V V V A
3.85 -
3.85 -
3.85 -
2.58 - 3.94 - - - - - - - - - - 0 0 0 - - - - - 3
2.48 - 3.8 - - - - - - - 0.1 0.1 0.1 0.44 0.44 1.0 2.5 40 10
2.40 - 3.70 - - - - - - - - - - 0.1 0.1 0.1 0.55 0.55 2.0
VI = VIH or VIL; 5.5 VO = VCC or GND VI = VCC or GND; IO = 0 5.5 -
0.25 - 4.0 10 - -
10.0 A 80 10 A pF
2000 Aug 15
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
74AHC164; 74AHCT164
74AHCT family With regard to recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 8.0 mA II IOZ input leakage current 3-state output OFF-state current VI = VIH or VIL VCC (V) - - 4.5 25 - 0.8 - - 0.1 0.36 0.1 Tamb (C) -40 to +85 - 0.8 - - 0.1 0.44 1.0 2.5 -40 to +125 UNIT - 0.8 -
MIN. TYP. MAX. MIN. MAX. MIN. MAX. 2.0 - 4.4 3.8 - - - 2.0 - 4.4 V V V V V V A
4.5 to 5.5 2.0 4.5 to 5.5 - 4.5 4.5 4.5 4.5 5.5 4.4
3.94 - - - - - 0 - - -
3.70 - - - - - 0.1 0.55 2.0
VI = VIH or VIL; 5.5 VO = VCC or GND per input pin; other inputs at VCC or GND; IO = 0 VI = VCC or GND; 5.5 IO = 0 VI = VCC - 2.1 V other inputs at VCC or GND; IO = 0
0.25 -
10.0 A
ICC ICC
quiescent supply current additional quiescent supply current per input pin input capacitance
-
- -
4.0 1.35
- -
40 1.5
- -
80 1.5
A mA
4.5 to 5.5 -
CI
-
-
3
10
-
10
-
10
pF
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
AC CHARACTERISTICS Type 74AHC164 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 3.0 to 3.6 V; typical values at VCC = 3.3 V tPHL/tPLH tPHL fmax tPHL/tPLH tPHL tW propagation delay CP to Qn propagation delay MR to Qn maximum clock pulse frequency propagation delay CP to Qn propagation delay MR to Qn see Figs 6 and 9 15 pF - see Figs 7 and 9 see Figs 6 and 9 - 80 6.5 5.3 125 9.3 7.6 - - - - - 75 CL 25
74AHC164; 74AHCT164
Tamb (C) -40 to +85 -40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
12.8 12.8 - 16.3 16.3 - - - - - -
1.0 1.0 65 1.0 1.0 5.0 5.0 6.0 1.5 2.5 45
15.0 15.0 - 18.5 18.5 - - - - - -
1.0 1.0 50 1.0 1.0 5.0 5.0 6.0 1.5 2.5 35
16.0 16.0 - 20.5 20.5 - - - - - -
ns ns MHz ns ns ns ns ns ns ns MHz
see Figs 6 and 9 50 pF - see Figs 7 and 9 - 5.0 5.0 5.0 1.5 2.5 50
clock pulse width HIGH see Figs 6 and 9 or LOW master reset pulse width LOW see Figs 7 and 9 see Figs 8 and 9 see Figs 8 and 9
tsu th trem fmax
set-up time Dsa, Dsb to CP hold time Dsa, Dsb to CP maximum clock pulse frequency
removal time MR to CP see Figs 7 and 9 see Figs 6 and 9
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
74AHC164; 74AHCT164
TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 4.5 to 5.5 V; typical values at VCC = 5.0 V tPHL/tPLH tPHL fmax tPHL/tPLH tPHL tW propagation delay CP to Qn propagation delay MR to Qn maximum clock pulse frequency propagation delay CP to Qn propagation delay MR to Qn see Figs 6 and 9 15 pF - see Figs 7 and 9 see Figs 6 and 9 - 125 4.5 4.0 175 6.4 5.8 - - - - - 115 9.0 8.6 - 11.0 10.6 - - - - - - CL 25
Tamb (C) -40 to +85 -40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
1.0 1.0 105 1.0 1.0 5.0 5.0 4.5 2.0 2.5 75
10.5 10.0 - 12.5 12.0 - - - - - -
1.0 1.0 85 1.0 1.0 5.0 5.0 4.5 2.0 2.5 65
11.5 11.0 - 14.0 13.5 - - - - - -
ns ns MHz ns ns ns ns ns ns ns MHz
see Figs 6 and 9 50 pF - see Figs 7 and 9 - 5.0 5.0 4.5 2.0 2.5 85
clock pulse width HIGH see Figs 6 and 9 or LOW master reset pulse width LOW see Figs 7 and 9 see Figs 8 and 9 see Figs 8 and 9
tsu th trem fmax
set-up time Dsa, Dsb to CP hold time Dsa, Dsb to CP maximum clock pulse frequency
removal time MR to CP see Figs 7 and 9 see Figs 6 and 9
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
Type 74AHCT164 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 4.5 to 5.5 V; typical values at VCC = 5.0 V tPHL/tPLH tPHL fmax tPHL/tPLH tPHL tW propagation delay CP to Qn propagation delay MR to Qn see Figs 6 and 9 see Figs 7 and 9 15 pF - - 125 50 pF - - 5.0 5.0 4.5 2.0 2.5 85 3.4 3.5 175 4.9 5.0 - - - - - 115 CL 25
74AHC164; 74AHCT164
Tamb (C) -40 to +85 -40 to +125 UNIT
MIN. TYP. MAX. MIN. MAX. MIN. MAX.
9.0 8.6 - 11.0 10.6 - - - - - -
1.0 1.0 105 1.0 1.0 5.0 5.0 4.5 2.0 2.5 75
10.5 10.0 - 12.5 12.0 - - - - - -
1.0 1.0 85 1.0 1.0 5.0 5.0 4.5 2.0 2.5 65
11.5 11.0 - 14.0 13.5 - - - - - -
ns ns MHz ns ns ns ns ns ns ns MHz
maximum clock pulse see Figs 6 and 9 frequency propagation delay CP to Qn propagation delay MR to Qn clock pulse width HIGH or LOW master reset pulse width LOW see Figs 6 and 9 see Figs 7 and 9 see Figs 6 and 9 see Figs 7 and 9 see Figs 8 and 9 see Figs 8 and 9 see Figs 7 and 9
tsu th trem fmax
set-up time Dsa, Dsb to CP hold time Dsa, Dsb to CP removal time MR to CP
maximum clock pulse see Figs 6 and 9 frequency
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
AC WAVEFORMS
74AHC164; 74AHCT164
handbook, full pagewidth
1/f max Vi CP input GND tW t PHL VOH Qn output VOL VM(2)
MNA601
VM(1)
t PLH
FAMILY AHC AHCT Fig.6
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM(1) INPUT 1.5 V
VM(2) OUTPUT 50% VCC
50% VCC 50% VCC
The clock (CP) to output (Qn) propagation delays, the shift clock pulse width (tW) and maximum shift clock frequency (fmax).
handbook, full pagewidth
Vi MR input GND tW t rem Vi CP input GND t PHL VOH Qn output VOL VM(2)
MNA603
VM(1)
VM(1)
FAMILY AHC AHCT Fig.7
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM(1) INPUT 1.5 V
VM(2) OUTPUT 50% VCC
50% VCC 50% VCC
The master reset (MR) pulse width, the master reset to output (Qn), propagation delays and the master reset clock (CP) removal time (trem).
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
74AHC164; 74AHCT164
handbook, full pagewidth
Vi CP input GND t su th Vi Dn input GND VOH Qn output VOL
MNA602
VM(1)
t su th
VM(1)
VM(2)
FAMILY AHC AHCT
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM(1) INPUT 1.5 V
VM(2) OUTPUT 50% VCC
The shaded areas indicate when the input is permitted to change for predictable output performance.
50% VCC 50% VCC
Fig.8 The data set-up (tsu) and hold (th) times for the (Dn) input.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL
MNA219
VO
1000
VCC open GND
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH open VCC GND
S1
Definitions for test circuit. CL = load capacitance including jig and probe capacitance (see Chapter "AC characteristics"). RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.9 Load circuit for switching times.
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
PACKAGE OUTLINES SO14: plastic small outline package; 14 leads; body width 3.9 mm
74AHC164; 74AHCT164
SOT108-1
D
E
A X
c y HE vMA
Z 14 8
Q A2 A1 pin 1 index Lp 1 e bp 7 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 8.75 8.55 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 0.028 0.024 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
inches 0.069
0.010 0.057 0.004 0.049
0.019 0.0100 0.35 0.014 0.0075 0.34
0.244 0.039 0.041 0.228 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT108-1 REFERENCES IEC 076E06 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2000 Aug 15
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
74AHC164; 74AHCT164
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c y HE vMA
Z
14
8
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-04-04 99-12-27
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
74AHC164; 74AHCT164
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
74AHC164; 74AHCT164
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, LFBGA, SQFP, TFBGA HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable REFLOW(1)
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
DATA SHEET STATUS DATA SHEET STATUS Objective specification PRODUCT STATUS Development
74AHC164; 74AHCT164
DEFINITIONS (1) This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
Preliminary specification
Qualification
Product specification
Production
Note 1. Please consult the most recently issued data sheet before initiating or completing a design. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
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Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
NOTES
74AHC164; 74AHCT164
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19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 68 9211, Fax. +359 2 68 9102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 800 943 0087 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V, Tel. +45 33 29 3333, Fax. +45 33 29 3905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615 800, Fax. +358 9 6158 0920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 4099 6161, Fax. +33 1 4099 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 2353 60, Fax. +49 40 2353 6300 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI), Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260, Tel. +66 2 361 7910, Fax. +66 2 398 3447 Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 2000
Internet: http://www.semiconductors.philips.com
SCA 70
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613507/01/pp20
Date of release: 2000
Aug 15
Document order number:
9397 750 07332

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